I-Vitried Bond Bheel Wheel back Bringy Wheel for Surding Greating Silicon Wafer

Vitried Bond Bheel Wheel Bheel Back Sking Wheel for Surding Griting Silico WAFER FEED

Incazelo emfushane:

Amasondo okugaya angemuva asetshenziselwa ikakhulukazi ukugaya nokugaya okuhle kwesilicon wafer. Le mikhiqizo ekhiqizwa yisikhungo sethu esinokusebenza okuphezulu kokugaya kanye nezindleko eziphakeme.
Ukusebenza kuphakathi kwezinga eliphakeme emhlabeni wonke. Zingasetshenziswa nama-japanese, amaJalimane, aseMelika, aseKorea kanye naseChina.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Amathegi Omkhiqizo

Vitrofied Bond Back Grifing Wheel
Lolu chungechunge lwe-Vitrified Diamond Wheel lusetshenziselwa ukuncipha emuva kokuncipha kanye nokunemba kwe-semiconductor ama-wafers, amadivaysi okuqonda, ama-silicon ahlanganisiwe we-silicon ama-silicon, kanye nama-wafers aluhlaza e-silicon.
Resin bond emuva isondo lokugaya
I-Resin Bond Back Grinking Wheel yenziwa kusuka ku-thermoset resin nedayimane, elisetshenziselwa ama-silicon wafers, iSapphire, Gallium NITRIDE, Gallium Arsenide, Gallium Arsenide, Gallium Arsenide, Gallium Arsenide, Gallium Arsenide, Gallium Arsenide.

Isifanekiso	D (mm)	T (mm)	H (mm)
6a2 / 6a2h	175	30, 35	76
	-Mashumi	35	76
	350	45	I-127
I-6A2t	195	22.5, 25	-Nqobile
I-6A2t	I-280	30	228.6
I-6A2T (ama-ellipses amathathu)	350	35	235
I-6A2T (ama-ellipses amathathu)	209	22.5	158
Okunye ukucaciswa kungakhiqizwa ngokuya ngesidingo samakhasimende.

Izinzuzo ze-Back Griting Wheel
1. Ngomonakalo ophansi kanye nekhwalithi ephezulu
Ukucutshungulwa okungaphelelwa yimvelo kungenzeka ngokubukhali okuphakeme
I-3. Kuyasiza ukunciphisa ukucubungula ukulimala, kuthuthukise ukusebenza kahle futhi kunciphise izindleko zokucubungula, futhi kuyathandeka ngokuya ngezidingo zamakhasimende

1.Izicelo zesondo lokugaya emuva:
Ukuncipha emuva, ukugaya kwangaphambili nokugaya okuhle kwamadivayisi ahlukile, ama-silicon ama-silicon ama-wafers, ama-silicon weafers, ama-arsenide, ama-chip asuselwa ku-silico, njll
2
I-3. Izinto zokwakha i-WorkPiece: I-Monocrystalline Silicon, Gallium Arsenide, I-Indium Phosphide, iSilico Carbide nezinye izinto ze-semiconductor.
4. Izicelo: Ukuncipha emuva, ukugaya okunzima nokugaya okuhle
Umshini wokugaya opplickable: Amasondo okugaya angemuva angasetshenziselwa ama-Japanese, amaJalimane, aseMelika, amaKorea (njenge-NTS, Shuwa, i-Engis, umshini wokugaya we-TSK, njll.).