Imboni ye-semiconductor ifuna ukunemba okungenakuqhathaniswa nokusebenza kahle, namasondo okugaya amadayimane aqhamuke njengamathuluzi abalulekile ukuze ahlangabezane nalezi zidingo eziqinile. Yaziwa ngobulukhuni bawo, ukuqina, nokusika ukusebenza kahle, amasondo okugaya amadayimane apitital ekufezeni ukubekezelela okuhle kanye nekhwalithi ephezulu engaphezulu edingekayo ekwenziweni kwemishini ye-semiconductor.
Izinqubo Zokukhiqiza zeSilicon semiconductor
I-Silicon Ingot ⇒ BandPhing (Electroplaw Bandsaw) ⇒ Cylindrical / Flat Ukugaya i-Silicon Ridicon Ama-Resin Wheels) ⇒ Dicing (DICING BLADES) ⇒ Ama-Chips ⇒
Izicelo ekukhiqizeni kwe-semiconductor
Qeda emuva ukugaya
Amasondo e-Diamond Gry asetshenziselwa kakhulu ukuncipha kwe-silicon ama-wafers kubukhulu obudingekayo, uqinisekisa indawo ebushelelezi neyisicaba ngenkathi kugcinwa ubuqotho bezinhlekelele.
Ukugaya okunqenqemeni
Ukuqinisekisa ukuqina kwe-chip futhi kunciphise ubungozi bokuqhekeka ngesikhathi sokuqhubeka, amasondo edayimane aqashwa ngokubumba okuqondile nokubusheleleka kwama-wafers.
Polishing and planization
Amasondo okugaya amadayimane aphezulu aphezulu abucayi ekufezekiseni indawo ephikisana efanayo ye-wafer, eqinisekisa ukuthi ahlangabezana nokucaciswa okuqinile kwezicelo ze-elekthronikhi.
Ukudonsa nokusika
Amasondo edayimane anika amandla ukusika okuhlanzekile nokunembile kwama-wafers kuma-chips ngamanye, anciphise imfucumfucu ebonakalayo kanye nokuqinisekisa ukuphuma okuphezulu.
E-Zhengzhou Ruizuan Diamond Tool Co, Ltd., Sisebenza ngokukhethekile ekuhlinzekeni amasondo aphezulu wokugaya amadayimane ahambisana nezidingo ezithile zomkhakha we-semiconductor. Imikhiqizo yethu ithuthukisiwe ngokunemba, ukusebenza kahle, nokuqina, iqinisekisa ukusebenza kahle kuzo zonke izinhlelo zokusebenza.
Isikhathi sePosi: Dec-20-2024