I-12a1 Wafer Hub Dicing wabona ama-blade diamond dicing blades for scribhing

I-12a1 Wafer Hub Dicing wabona ama-blade diamond dicing blades for befer scribing isithombe esifakiwe

Incazelo emfushane:

I-Diamond Dicing Blade isetshenziselwa ukugcwala, ukusika i-silicon wafer, ama-semiconductors ahlanganisiwe, ingilazi nezinye izinto embonini yolwazi nge-elekthronikhi. Ama-blades ethu okutshala ama-dicing afaka i-Diamond Hub Dicing Blade kanye neDayimane Hubless Dubling blade. Ama-Binders afaka i-resin bond dicing blade, insimbi ehlanganisa isibopho se-nickel blade kanye ne-electroformed nickel dicing blade.Loluhlobo lwe-electroplated.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Amathegi Omkhiqizo

Isicelo: Umbhali okhipha ama-IC Wafers, i-Gallium Arsenide, i-Gallium Phosphide, i-Epoxy Resin Board, ifreyimu ye-Alloy, i-Ceramic substrate, i-composite board nge-interlayer, njll
Ungakhethwa kanjani izinhlobo ezilungile ze-Wafer Dicing Blades ukusika izinto?
* I-Binder of Resin Bond (Amandla athambile) I-Dicing Blade, Spring Hard kanye Fittle Material
* I-Binder ye-Metal Bond (Amandla aphakathi) DICING
* I-Binter ye-Electroplated Bond (Hard Bonding), Brontle

Izinzuzo ze-Wafer Hub Dicing wabona ama-blades
Ukusikwa okuphezulu okuphezulu - kuqinisekisa ukukhishwa okuhlanzekile nokunembe okunempilo.
Ukuqina okuphakeme okuphakeme - kunciphisa ukudlidliza kweBlade ukuze uthuthukise ukuqina.
Umklamo we-kerf omncane - unciphisa ukulahleka kwezinto ezibonakalayo futhi athuthukise isivuno.
Impilo ye-blade enwetshiwe - Yenzelwe ukuqina nokusebenza okungaguquki.
Ukucaciswa okwenziwe ngokwezifiso - kuyatholakala ngobukhulu obuhlukile, amadayimane, kanye nosayizi we-grit ukufanisa izinhlelo ezithile.